发明名称 ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide electronic equipment that can be made compact and thin while maintaining stable electrical connection. SOLUTION: The electronic equipment is provided with a first molded body made of insulating material, a second molded body made of insulating material to be bound together with the first molded body, a substrate provided with a first conductive pattern and fixed to the first molded body or the second molded body, and a conductive member for connecting a second conductive pattern provided on an outer surface of at least either the first or the second molded body to the first conductive pattern, wherein the conductive member is provided so as to penetrate in a gap of matching faces of the first molded body and the second molded body. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008182517(A) 申请公布日期 2008.08.07
申请号 JP20070014724 申请日期 2007.01.25
申请人 TOSHIBA CORP 发明人 HATA YOSHIKAZU;HONDA TOMOKO;HONDA SATOSHI;KUROIWA NOBUYOSHI;NAKAHATA MASAOMI;MORIMOTO ATSUSHI;SATO KOICHI;TSUJIMURA TERUHIRO;TABATA MAKOTO;SAKURAI MINORU;KATO SHOJI
分类号 H01Q1/24;H01Q1/38 主分类号 H01Q1/24
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