发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To prevent a change in pressure of a treatment bath when introducing a supercritical fluid mixed with a chemical into the treatment bath in a treatment method of treating a substrate to be treated using the supercritical fluid as a medium. SOLUTION: In the substrate treatment method, the supercritical fluid is directly supplied to the treatment bath 22 to make the inside of the treatment bath 22 to a desired treatment pressure, and then the supercritical fluid mixed with the chemical is introduced into the treatment bath 22 from a mixing portion 25. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008182034(A) 申请公布日期 2008.08.07
申请号 JP20070014003 申请日期 2007.01.24
申请人 SONY CORP 发明人 SAGA KOICHIRO
分类号 H01L21/306;H01L21/027;H01L21/304 主分类号 H01L21/306
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