| 摘要 |
A method for manufacturing an electronics package is provided that comprises forming at least one module block by providing a carrier substrate having a recess, placing at least one electronic component die in said recess, filling said recess with a molding material, and depositing a circuit layer connected with said at least one component die. It further provides an electronics package, comprising a carrier substrate having a recess, at least one electronic component die placed in said recess, a molding material filling said recess, and a circuit layer connected with said at least one component die.
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