发明名称 Printed circuit board and manufacturing method thereof
摘要 <p>A plurality of wiring patterns (12a-12f) are formed so as to extend in parallel with each other. A plurality of test terminals are formed in a substantially rectangular shape such that respective widths thereof increase toward respective one sides from respective ends of the plurality of wiring patterns. The plurality of test terminals in each group are arranged so as to be aligned along a length direction of the wiring patterns. The wiring patterns are formed so as to be longer in the order, and the test terminals are further away from a mounting region in the order. An interval (width of a plating resist) between the test terminals in each group and the wiring patterns in the other group adjacent thereto is set to decrease in the order. The invention also relates to a manufacturing method for said wiring patterns and test terminals.</p>
申请公布号 EP1953822(A1) 申请公布日期 2008.08.06
申请号 EP20080250357 申请日期 2008.01.30
申请人 NITTO DENKO CORPORATION 发明人 TANI, EMIKO;ISHIMARU, YASUTO;MIZUTANI, TORU
分类号 H01L23/498;H05K1/02 主分类号 H01L23/498
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