PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

摘要

A printed circuit board and a manufacturing method thereof are provided to discharge heat by interposing an electromagnetic band gap structure having a heat sink between an analog circuit and a digital circuit. A printed circuit board(200) includes a first heat sink(210), a first dielectric layer(220), a second heat sink(230), a via(235), a second dielectric layer(240), and a metal layer(250). The first dielectric layer is formed on the first heat sink. The second heat sink is patterned with unit patterns repeatedly arranged on the second heat sink and is formed on the first dielectric layer. The via electrically connects the first and second heat sinks through the first dielectric layer. The second dielectric layer is formed on the second heat sink. The metal layer is patterned and is formed on the second dielectric layer.