Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film

摘要

A photo-curable resin composition comprising a silphenylene-bearing polymer having a Mw of 3,000-500,000 can be processed to form patterned films having a widely varying thickness from submicron to more than 20 µm. The cured films have good adhesion to substrates, heat resistance, electrical insulation and chemical resistance.