PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a manufacturing method thereof are provided to minimize loss of an interference effect caused by smaller size by having high electrical properties and low water absorption. A manufacturing method of a printed circuit board includes the steps of: forming an embossed internal circuit pattern(12) on a side of a substrate(10); heating a thermoplastic core substrate(20); laminating and pressing the substrate on the core substrate to prevent the internal circuit pattern from being exposed to the outside; forming an external circuit pattern(42) on the other side of the substrate; and forming a via(43) for electrical conduction between the internal circuit pattern and the external circuit pattern.