METHOD OF SORTING GOOD DIES USING DISCRIMINATION REGION

摘要

A method for sorting a normal die using a discrimination region is provided to determine effectively correspondence accuracy between a wafer and a wafer map by using a discriminate region. A wafer includes a chip region and an edge region. A plurality of dies are arranged in the chip region. One or more discriminate regions are arranged in the edge region. A wafer map for defining normal dies and abnormal dies is prepared by testing the dies. The dies defined by the wafer map correspond to the dies of the wafer(S22). A test process is performed to test whether the discriminate regions are included in the dies defined by the wafer map(S32). In the test process, the correspondence accuracy between the wafer and the wafer map is determined.