PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a manufacturing method thereof are provided to prevent spread of a bump by printing the bump for interlayer conduction inside a dam. A manufacturing method of a printed circuit board includes the steps of: forming a dam to surround an area corresponding to a bump(S10); forming an etching resist on a metal layer staked on an insulation layer(S11); providing etching liquid(S12); etching entire area of the metal layer except spots covered by the etching resist and removing the etching resist(S13); forming the bump by printing conductive paste(S20); and forming a bump substrate by laminating the insulation layer on a substrate(S30).