METHOD AND APPARATUS FOR ESTABLISHING OPTIMAL THERMAL CONTACT BETWEEN OPPOSING SURFACES

摘要

To achieve optimal thermal contact between opposing surfaces, it is necessary to align such surfaces so that maximum contact is achieved. In a semiconductor package, it is necessary to align the surface of a semiconductor integrated circuit (IC) and a heat sink surface, where the heat sink contains a nano-composite wire structure. By using a self-aligned structure that forces the alignment of the IC surface and the heat sink, maximum thermal contact between the two surfaces is achieved. The self-alignment of a pressure measurement device for same is also disclosed.