摘要 |
<p>The semiconductor component (19) has a ring shaped cooling component (7) that stores or dissipates heat generated by optically active layer, and includes metallic and ceramic materials. A coupling component (10) connects the optically active layer to the ring shaped cooling component, and includes a hollow space (9) partially or completely filled with liquid coolant (8). The optically active layer radiates electromagnetic radiation in radiation direction. The ring shaped cooling component is disposed in predetermined plane perpendicular to the radiation direction. Independent claims are also included for the following: (1) an arrangement; and (2) a production method of semiconductor component.</p> |