| 摘要 |
<p>A semiconductor device manufacturing system is provided to reduce a standby time by quickly transferring semiconductor substrates to plural cleaning modules. A semiconductor device manufacturing system includes a load-lock chamber(30), a transfer chamber(40), plural process modules(62,64,66,68), plural cleaning modules(72,74), and plural transfer modules(52,54,56). The load-lock chamber stores semiconductor substrates at a vacuum condition. The transfer chamber is connected to the load-lock chamber and transfers the semiconductor substrate. The process modules are arranged at both sides of the transfer chamber in a row and process the semiconductor substrate. The cleaning modules are connected to the transfer chambers and cleanse the semiconductor substrate from the process module. The transfer modules convey the semiconductor substrate among the load-lock chamber, the process module, and the cleaning module.</p> |
