| 摘要 |
<p>The card has a support zone (20) for supporting a ball grid array type electronic component (10), and an electronic layer (25) provided with an electrical heating resistance at right of the zone. The resistance provides heat quantity for soldering the component on a plate. Three electronic layers (21, 23, 25) conduct in alternation with electrical insulation layers (22, 24, 26). The resistance has a heating surface arranged on chips of the component, where the chips form electrical contacts. An independent claim is also included for a method for soldering/desoldering a ball grid array type electronic component on an electronic card.</p> |
