发明名称 APPARATUS FOR TREATMENT OF THE SUBSTRATE
摘要 An apparatus for processing a substrate is provided to improve an operation efficiency of a cleaning process by uniformly spraying a cleaning agent inside a process chamber. An apparatus for processing a substrate includes a process chamber and a top nozzle(200). A substrate treating process is performed in the process chamber. Plural first spray holes(212) are formed on a lower surface of a nozzle body unit(210). Plural second spray holes(214) are formed on a side surface of the nozzle body unit. A nozzle support unit(220) is connected to the upper surface of the nozzle body unit and supports the nozzle body unit. The top nozzle is arranged on the process chamber. A cleaning agent for cleaning an inner portion of the process chamber is sprayed through the top nozzle.
申请公布号 KR20080072263(A) 申请公布日期 2008.08.06
申请号 KR20070010765 申请日期 2007.02.01
申请人 SEMES CO., LTD. 发明人 SO, KYOUNG HO
分类号 H01L21/205 主分类号 H01L21/205
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