STAMPER AND PCB MANUFACTURING METHOD USING THEREOF

摘要

A stamper and a PCB(Printed Circuit Board) manufacturing method using the same are provided to improve adhesion between an embossed pattern and a plating layer by forming an uneven unit on the embossed pattern. A PCB manufacturing method includes the steps of: preparing a stamper with a first uneven unit on an embossed pattern(S21); forming an engraved pattern corresponding to the embossed pattern and the first uneven unit and a second uneven unit on an insulating layer by imprinting the stamper on the insulating layer(S22); and forming a circuit pattern on the insulating layer by plating the engraved pattern(S23). The third step includes the steps of: stacking a seed layer on a surface of the insulating layer; stacking a plating layer on the seed layer; and removing a part of the plating layer to expose the surface of the insulating layer.