发明名称 |
MULTILAYER FLEXIBLE WIRING CIRCUIT BOARD AND ITS MANUFACTURING METHOD |
摘要 |
A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer. |
申请公布号 |
EP1404166(A4) |
申请公布日期 |
2008.08.06 |
申请号 |
EP20020743789 |
申请日期 |
2002.07.03 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NAKAMURA, KEI;TANIGAWA, SATOSHI;YAMAZAKI, HIROSHI;HASEGAWA, MINEYOSHI |
分类号 |
H05K3/40;H05K1/00;H05K1/02;H05K3/20;H05K3/28;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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