发明名称 Semiconductor integrated circuit device having pads respectively provided with pad portions
摘要 A semiconductor device is provided with test-subject circuit 1 , test-irrelevant circuit 2 , first pads used for the test-subject circuit, and second pads used for the test-irrelevant circuit. The first pads include a plurality of divided pad portions while each of the second pads is provided with a single pad portion.
申请公布号 US7408368(B2) 申请公布日期 2008.08.05
申请号 US20070619824 申请日期 2007.01.04
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 BANNO MORIYASU
分类号 G01R31/02 主分类号 G01R31/02
代理机构 代理人
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