发明名称 |
Device manufacturing method and device, electro-optic device, and electronic equipment |
摘要 |
A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.
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申请公布号 |
US7408207(B2) |
申请公布日期 |
2008.08.05 |
申请号 |
US20050205169 |
申请日期 |
2005.08.17 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO TAKASHI;TAKAKUWA ATSHUSHI;KAMAKURA TOMOYUKI;UTSUNOMIYA SUMIO |
分类号 |
G02F1/1368;H01L31/0328;H01L21/02;H01L21/336;H01L21/77;H01L21/84;H01L27/108;H01L27/12;H01L27/13;H01L29/745;H01L29/786 |
主分类号 |
G02F1/1368 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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