| 摘要 |
A method and an apparatus for manufacturing an edge crack preventing type semiconductor device are provided to prevent an edge crack at a critical region outside an outermost boundary of a bump or a ball of a chip. An apparatus(10) for manufacturing an edge crack preventing type semiconductor device has a slant surface(11) on an upper corner of a chip(1), such that edge cracks are not formed on the semiconductor device. When an external force is applied on the slant surface, a portion of the external force is distributed along the slant surface. The slant surface is arranged inside an outermost boundary of a bump(2) or a ball of the chip.
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