发明名称 |
Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
摘要 |
In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.
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申请公布号 |
US7407081(B2) |
申请公布日期 |
2008.08.05 |
申请号 |
US20050095943 |
申请日期 |
2005.03.31 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
RICE MICHAEL R.;BJORKMAN CLAES H.;ZHAO JUN;COLLINS KENNETH S.;MIU THOMAS |
分类号 |
B23K1/00;B23K3/06;B23Q16/00;B65G1/00;H01L21/00;H01L21/48;H01L21/60;H01L21/68;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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