| 摘要 |
A wafer polishing device is provided to improve the product yield of semiconductor devices by preventing a wafer from being scratched due to collision between a polishing head and a conditioner. A wafer polishing device comprises a polishing pad(36) for polishing a wafer(32), a platen(40) for fixing and rotating the polishing pad, and a polishing head(30) installed on the polishing pad. The wafer is provided below the polishing head. A first motor(38) is provided to rotate the polishing head. A conditioner head(44) fixes a conditioner pad(42) and is rotated by a second motor(46). The conditioner pad is attached to a bottom of the conditioner head for the purpose of conditioning of the polishing pad. The polishing head and the conditioner head are surrounded by a magnet. |
