| 摘要 |
A conductive ball or a pin-mounted semiconductor packaging substrate, a method for manufacturing the same, and a conductive bonding material are provided to prevent separation of a conductive ball or a conductive pin from a conductive land or a through-hole of the semiconductor packaging substrate by using a thermosetting adhesive resin for representing a fluxing effect. A conductive ball or a pin-mounted semiconductor packaging substrate includes a conductive ball or a conductive pin mounted on a conductive land or a through-hole of the semiconductor packaging substrate. The conductive ball or the conductive pin is electrically connected with the conductive land or the through-hole through coating and reflow of a conductive bonding material. The conductive bonding material includes a conductive material formed with a low-melting point lead-free solder having a melting point of 130-170 degree centigrade and a thermosetting adhesive resin for representing a fluxing effect. |
