| 摘要 |
A substrate processing apparatus and a substrate processing method are provided to prevent damages to a substrate by completely preventing a discharge between process solution and the substrate. A substrate processing apparatus supplies process solution to a substrate and includes a spray unit(32) and a potential application unit(41). The spray unit successively sprays the conductive process solution to the substrate, such that the process solution flows on the substrate. A flow path is arranged from a container, which contains the process solution before spraying, to the spray unit. The potential application unit applies a potential on the process solution, when a spray process is preformed, such that a potential difference between the process solution and the substrate is decreased.
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