发明名称 Semiconductor device and manufacturing process therefore
摘要 A semiconductor device which can prevent a leak current between a silicide layer on a polysilicon and another part, as well as a manufacturing process therefor. The semiconductor device includes neighboring n- and p-type polysilicons; and a silicide layer thereon extending from the n-type polysilicon to the p-type polysilicon. The silicide layer is formed over the upper surfaces of the n- and p-type polysilicons except the periphery thereof.
申请公布号 US7407880(B2) 申请公布日期 2008.08.05
申请号 US20040002307 申请日期 2004.12.03
申请人 NEC ELECTRONICS CORPORATION 发明人 IZUMI KATSUYA
分类号 H01L21/28;H01L21/8238;H01L21/3205;H01L21/8242;H01L23/52;H01L27/108;H01L29/94 主分类号 H01L21/28
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