POLISHING PAD WITH GROOVES TO REDUCE SLURRY CONSUMPTION

摘要

A polishing pad with grooves to reduce slurry consumption is provided to increase the polishing rate for a semiconductor substrate while minimizing consumption of slurry used for polishing the semiconductor substrate. A polishing pad(100) cooperates with a carrier(104) having a carrier ring(108) including a plurality of carrier grooves(112) that face the polishing pad during the polishing process. The polishing pad comprises a polishing layer having a polishing surface. The polishing layer is supported by a backing layer, which is integrally formed with the polishing layer or not. The polishing pad has a disc shape so that the polishing surface has the center(O) and a circular peripheral portion(140). Pad grooves(116) are formed on the polishing surface through various methods.