| 摘要 |
<p>A polymer compound containing a silphenylene structure, a radiation curing resin composition containing the polymer compound, a method for forming a pattern by using the composition, and a film for protecting a circuit board using the pattern formed by the method are provided to form a micropattern having a wide range of thickness from 1 micrometer or less to 20 micrometers or more. A polymer compound containing a silphenylene structure comprises a repeating unit represented by the formula 1 and has a weight average molecular weight of 3,000-500,000, wherein R1 to R4 are identical or different one another and are a C1-C8 monovalent hydrocarbon group; m is an integer of 1-100; a is a positive integer; b is 0 or a positive integer; 0.5<=a/(a+b)<=1.0; X is a divalent organic group represented by the formula 2; Y is a divalent organic group; n is 0 or 1; R5 and R6 are identical or different one another and are a C1-C5 alkyl or alkoxy group; and k is 0, 1 or 2.</p> |
