发明名称 Stacked multi-gate transistor design and method of fabrication
摘要 A multi-body thickness (MBT) field effect transistor (FET) comprises a silicon body formed on a substrate. The silicon body may comprise a wide section and a narrow section between the wide section and the substrate. The silicon body may comprise more than one pair of a wide section and a narrow section, each pair being located at a different height of the silicon body. The silicon body is surrounded by a gate material on three sides. The substrate may be a bulk silicon substrate or a silicon-on-insulator (SOI) substrate. The MBT-FET combines the advantages of a wide fin device and a narrow fin device.
申请公布号 US7407847(B2) 申请公布日期 2008.08.05
申请号 US20060395860 申请日期 2006.03.31
申请人 INTEL CORPORATION 发明人 DOYLE BRIAN S;RAKSHIT TITASH;CHAU ROBERT S;DATTA SUMAN;BRASK JUSTIN K;SHAH UDAY
分类号 H01L21/84 主分类号 H01L21/84
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