COPPER FOIL FOR SUPER FINE PITCH PRINTED CIRCUIT BOARD

摘要

A bilayer copper foil for a micro-circuit is provided to secure uniform surface roughness of a copper layer and to make the copper layer thin by selectively etching a zinc or zinc alloy layer. A bilayer copper foil(100) for a micro-circuit is composed of a zinc or zinc alloy layer(20) keeping etching speed faster than that of pure copper and a copper layer(30) formed on the upper side of the zinc or zinc alloy layer and made of pure copper. The zinc alloy layer contains at least one alloying element of iron, molybdenum, tin, nickel, and chrome. The total thickness of the zinc layer and the copper layer is 10~100mum. The thickness of the copper layer is 1~5mum.