发明名称 Wired circuit board and production method thereof
摘要 A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.
申请公布号 US7407386(B2) 申请公布日期 2008.08.05
申请号 US20070705408 申请日期 2007.02.13
申请人 NITTO DENKO CORPORATION 发明人 ICHIKAWA KAZUSHI;TAKAYOSHI YUICHI
分类号 H01R12/00 主分类号 H01R12/00
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