发明名称 SRAM memory semiconductor integrated circuit device
摘要 In an integrated circuit device, there are various optimum gate lengths, thickness of gate oxide films, and threshold voltages according to the characteristics of circuits. In a semiconductor integrated circuit device in which the circuits are integrated on the same substrate, the manufacturing process is complicated in order to set the circuits to the optimum values. As a result, in association with deterioration in the yield and increase in the number of manufacturing days, the manufacturing cost increases. In order to solve the problems, according to the invention, transistors of high and low thresholds are used in a logic circuit, a memory cell uses a transistor of the same high threshold voltage and a low threshold voltage transistor, and an input/output circuit uses a transistor having the same high threshold voltage and the same concentration in a channel, and a thicker gate oxide film.
申请公布号 US7408231(B2) 申请公布日期 2008.08.05
申请号 US20050188735 申请日期 2005.07.26
申请人 RENESAS TECHNOLOGY CORP. 发明人 ISHIBASHI KOICHIRO;OSADA KENICHI
分类号 G11C11/41;H01L29/78;G11C11/401;G11C11/404;G11C11/412;G11C11/419;H01L21/8238;H01L21/8239;H01L21/8242;H01L21/8244;H01L27/092;H01L27/10;H01L27/108;H01L27/11;H01L29/76 主分类号 G11C11/41
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