| 摘要 |
A high frequency module is provided to reduce a total thickness and to reduce the number of manufacturing processes by using a surface mount method. A wiring substrate(110) includes an electrode to mount components. One or more chip components(120) are components except for a filter chip(130). The chip components are mounted on the wiring substrate. The filter chip is a bare chip of an unpacked state. One or more filter chips are mounted on the wiring substrate. A resin dam(140) is formed to surround the outside of the filter chip and the wiring substrate in a dam of a closed curve to form a sealed space in a lower part of the filter chip. A mold member(150) is formed on the wiring substrate to protect the chip components. |
