发明名称 BONDING SHEET STICKING EQUIPMENT AND METHOD
摘要 <p>Bonding sheet sticking equipment comprising a sticking unit including a sticking stage for supporting a substrate, a bonding sheet feeding device for feeding a bonding sheet onto the substrate supported by the sticking stage, and a head provided above the substrate movably up and down and pressing the bonding sheet fed from the bonding sheet feeding device sequentially against a plurality of sticking positions arranged on the substrate, and a device for transferring the sticking unit which has completed the operation for sticking the bonding sheet to one sticking position to above other sticking position where sticking operation by the bonding sheet has not yet completed, and an instrument for inspecting the sticking state of the bonding sheet already stuck by the sticking unit while the sticking unit is performing the sticking operation continuously.</p>
申请公布号 KR20080071483(A) 申请公布日期 2008.08.04
申请号 KR20077024707 申请日期 2006.11.14
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 UENO TETSURO;TSUJIKAWA TOSHIHIKO
分类号 H01L21/60;G02F1/1345;H05K3/32 主分类号 H01L21/60
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