| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode packaging substrate where a bottom substrate and an upper one are insulated electrically, and circuits, or the like having different functions are arranged on each substrate. SOLUTION: The light-emitting diode packaging substrate 1 comprises the bottom substrate 11 having an insulator in which a first through-hole is provided, a support film 4 (copper foil, or the like) for radiation that is laminated on one surface and is 50-500μm thick, and a conductive layer 5 provided on the other surface; a light-emitting diode element 2 joined to the support film for radiation inside the first through-hole in the insulator; an insulating intermediate layer 12 that is laminated at a part excluding the opening of the first through-hole in the other surfaces of the bottom substrate, and has a second through-hole communicating with the entire surface of the opening surface of the first through-hole; and an upper substrate 13 that is laminated at a part excluding the opening of the second through-hole in the surfaces, and has a third through-hole communicating with the entire surface of the opening surface in the second through-hole. The bottom substrate is electrically insulated from the upper one. COPYRIGHT: (C)2007,JPO&INPIT |
