| 摘要 |
A wiring substrate and a semiconductor device are provided to improve reliability by preventing delamination at an interface between a dam and a fillet of an underfill material. An electronic component is mounted on a main surface of a wiring board(50) through a bump. At least a part of a periphery of the electronic component is covered with a resin. A dam(56) is formed at least at a part of a periphery of an electronic component mounting area on the main surface of the wiring board. A surface of the dam in contact with the resin has a shape of continuously curved lines. In the wiring board, at least a part of the dam is formed along the periphery of the electronic component mounting area. |
