发明名称 SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE FOR EFFICIENT POWER MANAGEMENT AND METHOD FOR POWER MANAGEMENT THEREOF
摘要 A system in package semiconductor device for an efficient power management and a power management method thereof are provided to manage a power down operation by using alive blocks and local interface units formed on respective plural chips. Plural chips including a first chip(210) and a second chip(250) have an alive block(211), a local interface unit(221), and an IP block(231). Power is continuously supplied to the alive block, so that the alive maintains a turn on state. The local interface unit transfers data from an inside of the chip to another chip or receives data transferred from another chip. The IP block is designed to have an independent function to store and process the data. Each block of the chips is connected to each other through a first signal line unit(245). The first signal line unit transfers a signal required for activation or initialization of the chip. The alive block manages a power supply of the whole chips in response to an activation instruction from the outside or the signal transferred through the first signal line unit.
申请公布号 KR100850209(B1) 申请公布日期 2008.08.04
申请号 KR20070013336 申请日期 2007.02.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, CHEON SU;PARK, JIN KWON;LEE, JAE SHIN
分类号 H01L21/60 主分类号 H01L21/60
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