APPARATUS FOR TESTING SEMICONDUCTOR DEVICE AND METHOD FOR TESTING

摘要

An apparatus and a method for testing a semiconductor device are provided to prevent a vapor condensation generated on a lower surface of a socket board by providing heat to the lower surface of the socket board during a low-temperature test process. A package socket(40) is supported on a socket board(10). A packaged semiconductor device is mounted on the package socket. A cooling unit is located on the socket board in the state of being separated therefrom. A peltier device(60) is attached to the socket board. The peltier device has a first surface facing the cooling unit and a second surface facing the opposite surface to the first surface. A resistant material is connected to the peltier device to form a closed circuit. The resistant material faces the lower surface of the socket board. The resistant material is a heating element(62e). A signal cable(45) is connected to the socket board by passing through the heating element.