发明名称 |
PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL AND WAFER FRONT SIDE SCAVENGER PLASMA |
摘要 |
A process is provided for removing polymer from a backside of a workpiece. The process includes supporting the workpiece on the backside in a vacuum chamber while leaving a peripheral annular portion of the backside exposed. The process further includes confining gas flow at the edge of the workpiece within a gap at the edge of the workpiece on the order of about 1% of the diameter of the chamber, the gap defining a boundary between an upper process zone containing the front side and a lower process zone containing the backside. A first plasma is generated in a lower external chamber from a polymer etch precursor gas, and an etchant by-product is introduced from the first plasma into the lower process zone. A second plasma is generated in an upper external plasma chamber from a precursor gas of a scavenger of the etchant by-product, and scavenger species are introduced from the second plasma into the upper process zone.
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申请公布号 |
US2008179288(A1) |
申请公布日期 |
2008.07.31 |
申请号 |
US20070685767 |
申请日期 |
2007.03.14 |
申请人 |
COLLINS KENNETH S;HANAWA HIROJI;NGUYEN ANDREW;BALAKRISHNA AJIT;PALAGASHVILI DAVID;CRUSE JAMES P;SUN JENNIFER Y;TODOROW VALENTIN N;RAUF SHAHID;RAMASWAMY KARTIK;SCHNEIDER GERHARD M;YOUSIF IMAD;SALINAS MARTIN JEFFREY |
发明人 |
COLLINS KENNETH S.;HANAWA HIROJI;NGUYEN ANDREW;BALAKRISHNA AJIT;PALAGASHVILI DAVID;CRUSE JAMES P.;SUN JENNIFER Y.;TODOROW VALENTIN N.;RAUF SHAHID;RAMASWAMY KARTIK;SCHNEIDER GERHARD M.;YOUSIF IMAD;SALINAS MARTIN JEFFREY |
分类号 |
C23F1/00 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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地址 |
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