METHOD FOR MANUFACTURING LED PACKAGE

摘要

A method for manufacturing an LED(Light Emitting Diode) package is provided to prevent the color variation due to a beam angle by using the sedimentation of fluorescent particles and the evaporation of a diluent to form a fluorescent layer uniformly. A fluorescent substance(107) is dispersed and a curable transparent polymer material(108) diluted by a diluent(111) is prepared. The curable transparent polymer material is injected into a mounting space on which an LED chip(105) is mounted to coat the LED chip. The fluorescent substance dispersed in the injected transparent polymer is sedimented. After the fluorescent substance is sedimented, the diluent in the mounting space is evaporated to form a fluorescent layer arranged along a surface of the LED chip. After the fluorescent layer is formed, a transparent package resin covering the fluorescent layer is formed. Before the transparent polymer is coated on the LED chip, the LED chip is mounted on a bottom section of a reflective cup of a package body. In the coating process of coating the transparent polymer on the LED chip, the transparent polymer is injected into the reflective cup.