发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
Provided is a substrate processing apparatus for processing a substrate by using a processing solution oscillated with ultrasonic waves. The processing apparatus is provided with an oscillating body (32), which is a rectangular parallelepiped with a supply path (35) which opens at a lower plane of one end portion in the longitudinal direction and inclined toward the other end portion in the longitudinal direction; an oscillator (34) arranged on an upper plane of the oscillating body and oscillating the oscillating body with ultrasonic waves; and a heat exchanger (42) for cooling the processing solution supplied to the supply path. |
申请公布号 |
KR20080070795(A) |
申请公布日期 |
2008.07.31 |
申请号 |
KR20077017482 |
申请日期 |
2006.11.30 |
申请人 |
SHIBAURA MECHATRONICS CORPORATION |
发明人 |
KUROKAWA YOSHIAKI;HIGUCHI KOICHI |
分类号 |
H01L21/304;B08B3/10;G02F1/13;G02F1/1333 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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