| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a reliable, low-cost folded semiconductor device the area of which is reduced (miniaturized) by folding a printed-wiring board by utilizing an existing infrastructure. <P>SOLUTION: In the folded semiconductor device the area of which is reduced by mounting a semiconductor chip on one side or both sides of the flexible printed-wiring board and by folding the printed-wiring board, a film is used as an insulating layer of the printed-wiring board, where the glass transition temperature is not less than 300°C, tensile elastic modulus is 5-20 GPa, coefficient of linear expansion is -3 to +8 ppm/°C, and thickness is 2.5-40μm. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
