| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering method and a reflow soldering device capable of mounting components without damaging a base material even when performing reflow soldering of melting solder by irradiating it with a laser in an FPC using a synthetic resin such as PET as the base material. SOLUTION: In the flexible printed wiring board 1 using the synthetic resin such as the PET as the base material 1A, by preheating the solder 2 on the FPC 1 by a heating device 12 and then irradiating the solder 2 with the laser, the laser irradiation time becomes short and the reflow soldering is performed without damaging the base material 1A using the synthetic resin such as the PET. COPYRIGHT: (C)2008,JPO&INPIT |
