SILPHENYLENE-BEARING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND SUBSTRATE CIRCUIT PROTECTIVE FILM

摘要

A photo-curable resin composition comprising a silphenylene-bearing polymer having a Mw of 3,000-500,000 can be processed to form patterned films having a widely varying thickness from submicron to more than 20 mum. The cured films have good adhesion to substrates, heat resistance, electrical insulation and chemical resistance.