发明名称 PRE-MOLDED CLIP STRUCTURE
摘要 A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
申请公布号 WO2008091742(A2) 申请公布日期 2008.07.31
申请号 WO2008US50753 申请日期 2008.01.10
申请人 FAIRCHILD SEMICONDUCTOR CORPORATION;CRUZ, ERWIN, VICTOR;ESTACIO, MARIA, CRISTINA 发明人 CRUZ, ERWIN, VICTOR;ESTACIO, MARIA, CRISTINA
分类号 H01L23/495;H01L21/56 主分类号 H01L23/495
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