| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means which makes a contact with a probe card favorable by securing the flatness of a semiconductor wafer when the semiconductor wafer is vacuum-chucked on a wafer support of a wafer tray. <P>SOLUTION: A porous material 10 is arranged at the position of the wafer support 6a of a wafer tray 6. The porous material 10 is a material of a porous structure having a number of pores in a matrix. The semiconductor wafer 4 is arranged on the upper face of the porous material 10, a vacuum path 6b extending laterally through the wafer tray 6 is formed at the left sideward of the porous material 10, and the end of the porous material 10 leads to the vacuum path 6b. Thus, when it is exhausted from the vacuum passage 6b, the many pores in the matrix of the porous material 10 are discharged, and the lower face of the semiconductor wafer 4 is vacuum-chucked on the porous material 10 while the whole porous material 10 is uniformly reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
