发明名称 Heat dissipating device
摘要 A heat dissipating device includes: a heat sink including a casing having upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber, and a fin unit provided in the lower chamber; a pump mounted on the casing for withdrawing fluid from the lower chamber; and an external cooling unit including a radiator mounted on the casing and including first and second side tanks, conduits connected to the first and second side tanks, and a fin structure connected to the first and second side tanks and the conduits. The first side tank is in fluid communication with the pump. The second side tank is in fluid communication with the fluid inlet of the casing. A cooling fan faces toward the fin structure of the radiator.
申请公布号 US2008179044(A1) 申请公布日期 2008.07.31
申请号 US20070701201 申请日期 2007.01.31
申请人 MAN ZAI INDUSTRIAL CO., LTD. 发明人 HU JEN-LU;LIN HAO-HUI;LIN TSUNG-CHING
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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