| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a break in a wire drawn out from a wiring layer via land can be prevented. <P>SOLUTION: The semiconductor device according to the present invention comprises: a wiring board; a semiconductor chip; an underfill resin; a reinforcing ring; a heat spreader; a power source pattern and a wiring layer undersurface via land that are provided on the wiring board and are separated from each other by a clearance region; a dielectric; a wiring layer via land; a via; and a wiring that is provided on the dielectric to pass above the clearance region and connect the wiring layer via land and semiconductor chip. The wiring layer via land is provided in a region that is between the semiconductor chip and the reinforcing ring, and that is within a distance of 1 mm from an extension line of a diagonal line of the semiconductor chip. An angle formed between the draw-out direction of the wiring from the wiring layer via land and the extension line of the diagonal line of the semiconductor chip is 20 degrees or more. <P>COPYRIGHT: (C)2008,JPO&INPIT |
