发明名称 SUBSTRATE STRUCTURE, METHOD FOR DIVIDING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTROOPTICAL DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate structure having optical elements which can be scribed by laser processing, a method for dividing a substrate, and a method for manufacturing an electrooptical device. <P>SOLUTION: The substrate structure has a structure 15 which is formed in a lattice shape along planned cutting lines Dx,Dy so as to partition a plurality of microlenses 3 formed on the surface of a mother board W2. The structure 15 is formed in a lenticular shape by using the same material as that of the microlenses 3 in a process for forming the microlenses 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008175856(A) 申请公布日期 2008.07.31
申请号 JP20070006674 申请日期 2007.01.16
申请人 SEIKO EPSON CORP 发明人 KUROKI YASUNOBU;UMETSU KAZUNARI
分类号 G02B3/00;B23K26/00;B23K26/38;B23K26/40;B28D5/00;C03B33/09;G02F1/13357 主分类号 G02B3/00
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