发明名称 |
SUBSTRATE STRUCTURE, METHOD FOR DIVIDING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTROOPTICAL DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate structure having optical elements which can be scribed by laser processing, a method for dividing a substrate, and a method for manufacturing an electrooptical device. <P>SOLUTION: The substrate structure has a structure 15 which is formed in a lattice shape along planned cutting lines Dx,Dy so as to partition a plurality of microlenses 3 formed on the surface of a mother board W2. The structure 15 is formed in a lenticular shape by using the same material as that of the microlenses 3 in a process for forming the microlenses 3. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008175856(A) |
申请公布日期 |
2008.07.31 |
申请号 |
JP20070006674 |
申请日期 |
2007.01.16 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KUROKI YASUNOBU;UMETSU KAZUNARI |
分类号 |
G02B3/00;B23K26/00;B23K26/38;B23K26/40;B28D5/00;C03B33/09;G02F1/13357 |
主分类号 |
G02B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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