| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer processing apparatus that allows transfer of a wafer without contacting a processing surface of the wafer during the wafer transfer from a wafer holding means. <P>SOLUTION: The wafer processing apparatus comprises: a wafer holding means for holding a wafer; a processing means for processing the wafer held by the wafer holding means; and a transfer means for transferring the wafer processed by the processing means from the wafer holding means. The wafer holding means has a wafer holding plate which has a holding surface for holding the wafer and is removably supported by a holding base. The transfer means has a plate holding member for holding the wafer holding plate. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
