| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and device for attaching adhesive tape to the back side of a semiconductor wafer, with which the adhesive tape can be attached to the back side of the wafer safely and surely after the back side of the wafer is processed and the adhesive tape can be attached to the back side of from the lower part of the wafer without inverting the wafer so that a limited space of a clean room and the like can be effectively utilized. <P>SOLUTION: This invention relates to the attaching method of the adhesive tape to the back side of the semiconductor wafer in order to attach the adhesive tape 11 to the back side of a semiconductor wafer W after the back side of the semiconductor wafer W has been processed. The main features are that the semiconductor wafer W is held with the surface, where patterns are formed, facing upward, and that the adhesive tape 11 is attached to the back side of the semiconductor wafer W from the lower part. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
