| 发明名称 |
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM |
| 摘要 |
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
|
| 申请公布号 |
US2008179729(A1) |
申请公布日期 |
2008.07.31 |
| 申请号 |
US20080057299 |
申请日期 |
2008.03.27 |
| 申请人 |
SHIM IL KWON;HAN BYUNG JOON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN |
发明人 |
SHIM IL KWON;HAN BYUNG JOON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
